The integration of silicon photonics has moved from concept to reality within datacenters, driven by the growing demands of AI applications that require superior bandwidth and low latency connectivity. The role of high-performance interconnects is increasingly pivotal in advancing AI platforms.
Silicon photonics have been instrumental in creating scale-out networks, but the spotlight now shifts to co-packaged optics (CPO), an innovation set to minimize costs and elevate production volumes for AI systems. The transition, expected initially in networking, ultimately aims to link compute engines and memory systems seamlessly.
Optical interconnects don’t inherently boost link bandwidth but instead multiply connectivity possibilities, a crucial factor as AI models grow exponentially. These systems must manage connections for a vast number of processing units and potentially integrate innovative optical interposer technologies.
Achieving this scale demands industry collaboration to develop efficient manufacturing processes at a competitive cost. For detailed insights, industry leaders are set to discuss these advancements in an upcoming webinar on November 5, featuring experts such as Erez Shaizaf of Alchip and Adit Narasimha from Astera Labs.
This event promises in-depth knowledge for IT professionals keen on exploring how CPO could redefine AI infrastructure and performance.