Reports suggest that Apple is collaborating with Broadcom to create a specialized server chip to enhance AI functions in its systems. Insiders reveal the initiative, codenamed ‘Baltra’, aims for a 2026 release. While details remain scarce, it’s expected that this processor will integrate with Apple’s cloud and on-device services, leveraging Apple’s history with custom silicon.

The synergy between Apple and Broadcom extends from their ongoing partnerships, including work on 5G components. Broadcom’s experience in high-speed networking and packaging technology is likely to play a pivotal role in this joint venture. Recently showcased advancements support efficient multi-die architectures, demonstrating how multiple dies can be stacked using advanced methods, akin to AMD’s MI300X structure.

Broadcom’s newly introduced 3.5D packaging scheme marks a significant evolution, promoting density and efficiency by facilitating enhanced interconnection and speed. Such innovation aligns with the demands of AI workloads, allowing expansive computational capabilities within compact dimensions.

Though no official statements from Apple or Broadcom have been made, the alignment of both companies’ research timelines suggests a coordinated effort in materializing these cutting-edge technologies by 2026.