At the annual CES event in Las Vegas, AMD unveiled an extensive array of CPUs, catering to both high-end desktop users and gaming notebook enthusiasts, alongside pioneering AI PC developments. As part of this launch, AMD introduced the Ryzen AI Max 300 series, further enhancing their premium lineup with the code-named Strix Halo model, while expanding the Ryzen AI 300 series.

The Strix Halo components feature up to 40 RDNA 3.5 GPU cores, achieving remarkable performance capabilities with a combined 126 TOPS — primarily thanks to the enhanced GPU. AMD’s cutting-edge GPUs are designed to support substantial AI workloads, even though not all applications optimize for NPU efficiency.

In contrast to previous models, the Strix Halo components reduce memory footprint, supporting up to 128GB of LPDDR5x RAM, limiting direct GPU access to 96GB. Beyond individual model capabilities, AMD plans to release Pro variants offering enterprise-grade features like fleet management and cloud recovery.

Additionally, AMD revives its X3D cache technology with the 9955HX3D mobile chip, boasting 144MB of cache. This technology significantly enhances processing speed for cache-heavy applications such as gaming. Alongside the mobile chip, AMD revealed two non-X3D models: the 9955HX and Ryzen 9 9850HX.

Further broadening its range, AMD announced CPU options for handheld gaming, including the new Z2 chips, equipped with up to eight Zen 5 CPU cores and up to 16 RDNA graphics cores. AMD also continues support for its Zen 4 cores, despite newer developments, highlighting updated Ryzen 200 and Ryzen Pro 200 processors. These new entries maintain AMD’s competitive edge in the processor market for diverse computing needs and will hit the market soon.